Facility access fees
The Quantum-Nano Fabrication and Characterization Facility (QNFCF) operates on a Core Research Facility model where our members can access shared equipment and are invoiced lab fees to partially defray the lab's cost of operations. ÌýThe following fees are charged for accessing the QNFCF.
- Onboarding fee: ÌýNew registrants wishing to access the QNC cleanroom will be charged a one time registration fee of $200.
- Equipment use fees: ÌýEquipment use (as measured by NEMO enable time) generates an equipment use fee as outlined in the table below.
- Per-enable fee: ÌýA "per-enable" fee of $1.84 for academic member ($5.52 for industrial members) is levied at every new tool enable in NEMO. ÌýThis is intended to defray the cost of consumables such as gloves, cleanroom suits and cleanroom wipes.
- Training fees: ÌýAll training in the QNFCF is staff led and generates a surcharge above the normal equipment use fee. ÌýThis surcharge is $25/hour for academic members and $75/hour for industrial members. ÌýThis fee is intended to partially defray the cost of staff labour.
- Staff support fees: ÌýWhen a QNFCF staff member is performing work on behalf of a researcher this generates a surcharge above the normal equipment use fee. ÌýThis surcharge is $50/hour for academic members and $150/hour for industrial members. ÌýThis fee is intended to completely defray the cost of staff labour.
- Inventory fees:Ìý The QNFCF maintains a stock of commonly used items and other material that areÌýnot economically feasible for individual members to purchase from suppliers themselves. ÌýA partial list of these items is below with prices listed in NEMO. ÌýPricesÌýchange regularly with inflation and exchange rate variations. ÌýThe QNFCF endeavours to provide these items to all members on a cost neutral basis.
Equipment use fees table
³¢´Ç³¦²¹³Ù¾±´Ç²ÔÌý | Tool Type | NEMO Tool Name |
Academic Rate |
±õ²Ô»å³Ü²õ³Ù°ù¾±²¹±ôÌýRate |
QNC cleanroom | Lithography - Jeol 100kV E-beam Litho | JEOL-EBL | Ìý$120 | Ìý$360 |
QNC cleanroom | Lithography - Raith 150TWO 30kV E-beam Litho | RAITH-EBL | Ìý$60 | Ìý$180 |
QNC cleanroom | Lithography - Suss MA6 front/back UV aligner | SUSS-align | Ìý$35 | Ìý$105 |
QNC cleanroom | Lithography - Suss SB6 GEN2Ìý wafer bonder | SUSS-bond | Ìý$35 | Ìý$105 |
QNC cleanroom | Lithography - Heidelberg front/back maskless UV | HEIDELBERG-MLA | Ìý$40 | Ìý$120 |
QNC cleanroom | Lithography - HMDS oven | YES-HMDS | Ìý$25 | Ìý$75 |
QNC cleanroom | Lithography - UV semi-auto spin/bake | BREWER-UVspinbake | Ìý$30 | Ìý$90 |
QNC cleanroom | Lithography - E-beam semi-auto spin/bake | BREWER-Ebeamspinbake | Ìý$35 | Ìý$105 |
QNC cleanroom | Lithography - PR spin/bake station | REYNOLDSTECH-twincoater | Ìý$25 | Ìý$75 |
QNC cleanroom | Lithography - atmospheric oven | FISHER-oven | Ìý$15 | Ìý$45 |
QNC cleanroom | Deposition - E-beam evaporator | ANGSTROM-Ebeam | Ìý$35 | Ìý$105 |
QNC cleanroom | Deposition - E-beam evaporator | INTLVAC-Ebeam | Ìý$35 | Ìý$105 |
QNC cleanroom | Deposition - Thermal evaporator for Au/Be films | ANGSTROM-thermal | Ìý$35 | Ìý$105 |
QNC cleanroom | Deposition - ALD & PECVD cluster tool | OXFORD-cluster | Ìý$50 | Ìý$150 |
QNC cleanroom | Deposition - PVD for Nb superconducting films | PLASSYS-sputter | Ìý$40 | Ìý$120 |
QNC cleanroom | Deposition - PVD for Al superconducting films | PLASSYS-Ebeam | Ìý$40 | Ìý$120 |
QNC cleanroom | Deposition - oxidation/anneal furnace | TYSTAR1-atm | Ìý$40 | Ìý$120 |
QNC cleanroom | Deposition - LPCVD Nitride furnace | TYSTAR2-nitride | Ìý$45 | Ìý$135 |
QNC cleanroom | Deposition - LPCVD Poly Si furnace | TYSTAR3-PolySiC | Ìý$45 | Ìý$135 |
QNC cleanroom | Deposition - LPCVD LTO furnace | TYSTAR4-LTO | Ìý$45 | Ìý$135 |
QNC cleanroom | Deposition - Twin chamber sputter | AJA-sputter | Ìý$40 | Ìý$120 |
QNC cleanroom | Deposition - atmospheric RTA/RTP | ALLWIN-RTP | Ìý$40 | Ìý$120 |
QNC cleanroom | Deposition - atmospheric RTA/RTP | ALLWIN-RTP2 | Ìý$40 | Ìý$120 |
QNC cleanroom | Etch - ICPRIE Cl chemistries | OXFORD-metalRIE | Ìý$45 | Ìý$135 |
QNC cleanroom | Etch - ICPRIE F chemistries for deep Si etch | OXFORD-SiRIE | Ìý$45 | Ìý$135 |
QNC cleanroom | Etch - Oxygen plasma asher | YES-ash | Ìý$25 | Ìý$75 |
QNC cleanroom | Etch - Ion mill with SIMS endpoint detection | AJA-ionmill | Ìý$45 | Ìý$135 |
QNC cleanroom | Characterization - reflectometer | FILMETRICS-F40 | Ìý$10 | Ìý$30 |
QNC cleanroom | Characterization - reflectometer -auto | FILMETRICS-F50 | Ìý$10 | Ìý$30 |
QNC cleanroom | Characterization - semiconductor microscope | OLYMPUS-scope1 | Ìý$20 | Ìý$60 |
QNC cleanroom | Characterization - semiconductor microscope | OLYMPUS-scope2 | Ìý$20 | Ìý$60 |
QNC cleanroom | Characterization - stylus profilometer | VEECO-profilometer | Ìý$20 | Ìý$60 |
QNC cleanroom | Characterization - stylus profilometer | BRUKER-profilometer | Ìý$20 | Ìý$60 |
QNC cleanroom | Characterization - 4-point probe Rs mapper | CDE-4pp | Ìý$20 | Ìý$60 |
QNC cleanroom | Characterization - film stress measurement tool | TOHO-stress | Ìý$30 | Ìý$90 |
QNC cleanroom | Characterization - thin film ellipsometer | WOOLLAM-ellip | Ìý$40 | Ìý$120 |
QNC cleanroom | Characterization - electrical probe station | SUSS-probe | Ìý$15 | Ìý$45 |
QNC cleanroom | Characterization - electrical probe station | EVERBEING-probe | Ìý$15 | Ìý$45 |
QNC cleanroom | Characterization - SEM sample coater | LEICA-coater | Ìý$40 | Ìý$120 |
QNC cleanroom | Characterization - scanning electron microscope | JEOL-SEM | Ìý$45 | Ìý$135 |
QNC cleanroom | Characterization - atomic force microscope | BRUKER-AFM | Ìý$40 | Ìý$120 |
QNC cleanroom | Other - critical point dryer | TOUSIMIS-CPD | Ìý$30 | Ìý$90 |
QNC cleanroom | Wetbenches - for acids & bases (non HF) | ACIDBASEnonHF | Ìý$25 | Ìý$75 |
QNC cleanroom | Wetbenches - for HF acid solutions | HFACID | Ìý$25 | Ìý$75 |
QNC cleanroom | Wetbenches - solvents only | SOLVENT1 | Ìý$25 | Ìý$75 |
QNC cleanroom | Wetbenches - solvents only | SOLVENT2 | Ìý$25 | Ìý$75 |
Wetbenches - for RCA clean solutions | RCACLEAN | Ìý$25 | Ìý$75 | |
QNC cleanroom | Wetbenches - for KOH based bulk Si etch | REYNOLDSTECH-bulkSi | Ìý$12 | Ìý$36 |
QNC cleanroom | Wetbenches - for Piranha organic cleans | PIRANHA | Ìý$25 | Ìý$75 |
QNC cleanroom | Wetbenches - for UV develop processes | DEVELOPUV | Ìý$25 | Ìý$75 |
QNC cleanroom | Wetbenches - EBL develop processes | DEVELOPEBL | Ìý$25 | Ìý$75 |
QNC 1706 | Packaging LabÌý- LWD opt microscope | OLYMPUS-scope3 | Ìý$15 | Ìý$45 |
QNC 1706 | Packaging LabÌý- Dicing saw | DISCO-saw | Ìý$40 | Ìý$120 |
QNC 1706 | Packaging LabÌý- wirebond pull tester | WESTBOND-pulltest | Ìý$10 | Ìý$30 |
QNC 1706 | Packaging LabÌý- Manual wirebond | WESTBOND-wirebond1 | Ìý$40 | Ìý$120 |
QNC 1706 | Packaging LabÌý- Semi-auto wirebond | WESTBOND-wirebond2 | Ìý$40 | Ìý$120 |
QNC 1706 | Packaging LabÌý- Flip chip die bonder | TRESKY-diebond | Ìý$20 | Ìý$60 |
QNC 1706 | Packaging LabÌý- epoxy dispenser robot | NORDSON-epoxy | Ìý$15 | Ìý$45 |
QNC 1706 | Packaging LabÌý- H2 plasma cleaner | LFC-plasmaclean | Ìý$30 | Ìý$90 |
QNC 1706 | Packaging LabÌý- epoxy cure oven | Cureoven | Ìý$15 | Ìý$45 |
QNC 1706 | Packaging LabÌý-Ultron wafer cleaner | Ìý | Ìýno chargeÌý | Ìýno chargeÌý |
QNC 1508 | Sample Prep LabÌý- Cont. ang. goniometer | RAMEHART-contactangle | Ìý$15 | Ìý$45 |
QNC 1508 | Sample Prep LabÌý- diamond scribe tool | OEG-scriber | Ìý$30 | Ìý$90 |
QNC 1508 | Sample Prep LabÌý- Solvents hood | FUMEHOOD-north | Ìý$10 | Ìý$20 |
QNC 1508 | Sample Prep LabÌý- Acids/Bases hood | FUMEHOOD-south | Ìý$10 | Ìý$20 |
QNC B614 | SW LabÌý- Beamer EBL software | BEAMER | Ìýno chargeÌý | ÌýTBDÌý |
QNC B614 | SW LabÌý- Layout Editor SW | LayoutEditor | Ìýno chargeÌý | ÌýTBDÌý |
QNC B614 | SW LabÌý- Ellipsometery SW | CompleteEASE | Ìýno chargeÌý | ÌýTBDÌý |
QNC B614 | SW LabÌý- Raith GDSII editor | RAITH-GDS | Ìýno chargeÌý | ÌýTBDÌý |
QNC B709 | QNC MetrologyÌý- JEOL F200 S/TEM w. EELS | JEOL-TEM | Ìý$75 | Ìý$225 |
QNC B711 | QNC Metrology - Zeiss Auriga SEM-FIB | ZEISS-SEMFIB | Ìý$100 | Ìý$300 |
QNC B703 | QNC TEM Sample PrepÌý- Polisher | ALLIED-polish | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Microscope | ZEISS-scope | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Multi-tool | LEICA-EMTXP | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Dimpler | SOUTHBAY-dimpler | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Saw | SOUTHBAY-saw | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Ion mill | LEICA-ionmill | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Disc cutter | GATAN-cutter | Ìý$20 | Ìý$60 |
QNC B703 | QNC TEM Sample PrepÌý- Polisher | SOUTHBAY-polish | Ìý$10 | Ìý$30 |
QNC B706 | Thin film ellipsometer | WOOLLAM-ellip2 | Ìý$40 | Ìý$120 |
RAC1 1013 | Crystal cutter (disc) | ALLIED-xtal-cut-R1 | Ìý$20 | Ìý$60 |
RAC1 1013 | Wire cutter | WIRETEC-wire-saw-R1 | Ìý$20 | Ìý$20 |
RAC1 1013 | Lapper | Lapper-R1 | Ìý$20 | Ìý$60 |
RAC1 1013 | Leitz microscope | LEITZ-scope-R1 | Ìý$20 | Ìý$60 |
RAC1 1013 | Evovision stereo microscope | EVOVISION-scope-R1 | Ìý$20 | Ìý$60 |
RAC1 1013 | PlasmaEtch reactive ion etcher | PLASMAETCH-plasmaclean-R1 | Ìý$15 | Ìý$45 |
RAC1 1013 | Manual wirebond | WESTBOND-wirebond-R1 | Ìý$40 | Ìý$120 |
RAC1 1013 | Rofin welder | ROFIN-welder-R1 | Ìý$25 | Ìý$75 |
RAC1 1013 | Wetbench for HF acid solutions | WB-HFACID-R1 | Ìý$25 | Ìý$75 |
RAC1 1013 | Wetbench - for acids & bases (non HF) | WB-ACIDBASEnonHF-R1 | Ìý$25 | Ìý$75 |
RAC1 1013 | Wetbench - for solvents only | WB-SOLVENT-R1 | Ìý$15 | Ìý$45 |
RAC1 1013 | TestEquity thermal chamber | TESTEQUITY-Tchamber-R1 | Ìý$2 | Ìý$6 |
RAC1 1013 | Assembly station 1 | AssemblyStation1-R1 | Ìý$1 | Ìý$3 |
RAC1 1013 | Assembly station 2 | AssemblyStation2-R1 | Ìý$1 | Ìý$3 |
RAC1 2003 | Mitutoyo microscope | MITUTOYO-scope-R1 | $20 | Ìý$60 |
RAC1 2003 | BRUKER optical profilometer | BRUKER-contour-R1 | Ìý$20 | Ìý$60 |
RAC1 2003 | Gloveboxed thermal evaporator | Inert-AngstromEvap-R1 | Ìý$35 | Ìý$105 |
RAC1 2003 | Gloveboxed SEM with NPGS | Inert-Jeol-EBSEM-R1 | Ìý$40 | Ìý$120 |
RAC1 2003 | Gloveboxed 2D assembly microscope | Inert-Olympus-2DAScope-R1 | Ìý$20 | Ìý$60 |
RAC1 2003 | Gloveboxed Reactive Ion Etch | Inert-PLASMAETCH-RIE-R1 | Ìý$20 | Ìý$60 |
RAC1 2003 | Gloveboxed chem processing w/ spin coat | Inert-PrepFab-Station-R1 | Ìý$30 | Ìý$90 |
RAC1 2003 | Gloveboxed Atomic Force Microscopy | Inert-VEECO-AFM-R1 | Ìý$35 | Ìý$105 |
RAC1 2003 | Inert lab solvents fumehood | Inert-WB-Solvents-R1 | Ìý$15 | Ìý$45 |
RAC1 2003 | Inert lab acid/Base fumehood | Inert-WB-Acidbase-R1 | Ìý$15 | Ìý$45 |
RAC2 2021 | UHV Sputter and E-beam deposition | AJA-Sputter-EBeam-R2 | Ìý$40 | Ìý$120 |
RAC2 2021 | LPCVD carbon nanotubes | ANGSTROM-LPCVD-R2 | Ìý$40 | Ìý$120 |
RAC2 2021 | LPCVD Silicon nanowires | 1stNANO-SiNW-R2 | Ìý$45 | Ìý$135 |
RAC2 2031 | Pulsed Laser Deposition system | TSST-PLD-R2 | Ìý$40 | Ìý$120 |
RAC1 1013 | Automated Glass Processing Station | VYTRAN-splicer-R2 | Ìý$20 | Ìý$60 |
RAC2 2112 | X-ray diffraction | D8-VENTURE-XRD-R2 | Ìý$40 | Ìý$120 |
RAC2 1124 | Cryogenic Scanning Tunneling Microscope | OMICRON-LT-SPM-R2 | Ìý$50 | Ìý$150 |
Inventory items (fees listed in NEMO)
- AFM probes:
- ScanAsyst-Air
- Containers:
- 125 x 65 mm PYREX crystallisation dish
- 1" wafer holder
- 2" wafer holder
- 3" wafer holder
- 4" wafer holder
- 4" wafer holder (black polypropylene)
- 6" wafer holder
- 400ml pyrex beakers
- Acid kit
- Additional cleanroom notebook
- Beaker box
- Beaker kit
- 1" x 1" Gel-box (black conductive)
- 100 mm glass petri dish
- large polystyrene petri dish
- small polystyrene petri dish
- small polystyrene petri dish - sectioned
- Nalgene bottle (250 ml)
- Nalgene bottle (500 ml)
- Nalgene bottle (1ÌýL)
- Nalgene bottle (2 L)
- 10 ml glass photoresist syringe
- Tweezer box
- PTFE chip carrier (for chemical processing)
- Lapping supplies
- Diamond lapping films
- Red cloth disk
- Evaporation and sputter precious metals
- Ag pellets
- Au pellets
- Pd pellets
- Pt pellets
- Au sputter target (sold by depositionÌýtime)
- Pt sputter target (sold by deposition time)
- Metrology supplies
- Compact TEM grid box
- Reverse tweezers (fine)
- Sample membrane box
- TEM grids
- Resist
- ZEP520A Electron beam resist
- Service charge
- Shipping and handling of samples
- Cleanroom tools
- 2A PEEK replacement tweezer tips
- PEEK rounded tip tweezers
- 4" wafer tweezers (ESD safe)
- 4" wafer tweezer replacement tips
- Wafers
- 3" prime CZ <100> Silicon
- 4" prime CZ <100> Silicon
- 6" prime CZ <100> Silicon
- 100mm borofloat 33 glass DSP wafer