Wafer stress measurement [TOHO-stress]

Vendor:听

Model:听FLX-2320-R

Purpose:听Measuring thin film stress

Equipment description:

The Toho FLX-2320-R is used to determine the stress state of a thin film on a wafer. The Toho uses a laser-photodiode setup is used to determine the height profile (or bowing) of a wafer. Using bowing measurements taken before film deposition and after film deposition the Toho uses a modified Stoney鈥檚 equation to determine the stress of the film.

System features:

  • 3鈥, 4鈥 and 6鈥 wafer handling
  • Dual selectable laser wavelengths
  • Automated rotation for accurate stress mapping
  • 3D visualization
TOHO-stress

TOHO-stress