Selected publications

MEMS = Micro-electromechanical systems聽

MOEMS聽= Micro-(opto)-electromechanical systems聽

ASME = American Society of Mechanical Engineers

SPIE = The Society of Photographic Instrumentation Engineers

IEEE = The Institute of Electrical and Electronics Engineers

PECVD = Plasma-enhanced chemical vapor deposition

Refereed journal publications

  • Hassanpour P.A., Nieva P.M., and Khajepour A., "," J. Sound and Vibration, Vol. 330, No. 23, pp. 5753-5768, November 2011.

  • Dyck N.C., Denomme R.C., and Nieva P.M.,"," J. Phys. Chem. C, Vol. 115, No. 31, pp. 15225-15233, June 2011

  • Hassanpour P.A., Nieva P.M., and Khajepour A.,"," Submitted to the J. Microsystem Technology, June 2011.

  • Hassanpour P.A., Nieva P.M., and Khajepour A., "," Submitted to the Journal of Applied Mathematical Modelling, March 2011.

  • Shavezipur M., Hashemi S., Nieva P.M., and Khajepour A., "," Microelectronics Engineering Journal, Vol. 87, pp. 1721-1727, November 2010.

  • Shavezipur M., Nieva P.M., Khajepour A., and Hashemi S.M., "," J. Micromech. Microeng., Vol. 20, doi: 10.1088/0960-1317/20/2/025009, February 2010.

  • Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J.,"," Sens. and Act.: A Phys., Vol.157, No. 2, pp. 235-245, 2010."

  • Zwart A., Derige G., Effa D., Nieva P.M., and Lancaster S., "," Sensors & Transducers J., Special Issue, 7, pp. 179-190, October 2009.

  • Shavezipur M., Nieva P.M, Hashemi S., and Khajepour A.,"," Sensors & Transducers J., Special Issue, 7, pp. 15-24, October 2009.

  • Nieva P.M., Kuo J., Chiang S., and Syed A., "," Journal Sadhana, Springer India, Vol. 34 No. 4, pp.615-623, August 2009.

  • Shavezipur M., Nieva P.M., Hashemi S., and Khajepour A., "," Sensors & Transducers Journal, Special Issue, October 2009, Vol. 7, pp. 15-24, 2009.

  • Elbuken C., Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J., "," J. Microsyst. Tech., Vol. 15, pp. 713-722, 2009

  • Nieva P.M., McGruer N., Adams G., and DiMarzio C., "A fabry-perot interferometric system for the experimental verification of the air viscous damping in MEMS," Int. J. Micro and Nano Systems, Accepted October 2008.

  • Shavezipur M., Hashemi S.M., Nieva P.M., and Khajepour A., "," Microelectronics Journal, 2008.

  • Nieva P.M., Kuo J., Chiang S.W., and Syed A., "," Journal Sadhana, Indian Academy of Science, Accepted September 15, 2007.

  • Nieva P.M., ," Sensors & Transducers Journal, Special Issue, pp.10-20, October 2007.

  • Nieva P.M., McGruer N., Adams G., and DiMarzio C., "Experimental verification of the air viscous damping in MEMS using a fabry-perot interferometric technique," Applied Optics, OSA, 2007.

  • Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J., "Composite region thermal modeling of uncooled microbolometer pixel," Submitted to Journal of Physics D: Applied Physics, IoP, 2007.

  • Nieva P.M., McGruer N., and Adams G., "," J. Micromech. Microeng., Vol. 16, pp. 2618-2631.

  • Tada H., Kumpel A., Lathrop R.E., Nieva P.M., Zavracky P., Miaoulis I., and Wong P., "," J. Appl. Phys., Vol. 87, No. 9, pp. 4189-4193, 2000.

  • Tada H., Kumpel A., Lathrop R., Slanina J., Nieva P.M., Zavracky P., Miaoulis I., and Wong P., "," Rev. Sci. Instrum., Vol. 71, No. 1, pp. 161, 2000.

  • Abramson A., Nieva P.M., Tada H., Zavracky P., Miaoulis I. and Wong P., "," J. Mater. Res., Vol. 14, No.6, pp. 2402-2410, 1999.

Full papers in refereed conference proceedings

  • Asiaei, S., Denomme, R., Marr, C., Nieva, P., Vijayan, M., "," Microfluidics, BioMEMS, and Medical Microsystems, SPIE MEMS-MOEMS, January 2012.

  • P. Nieva, J. Godin, R. Norris, A. Sohi, T. Leung, "", SPIE Photonics West 2012 MEMS-MOEMS, January 2012.

  • Denomme, R., Young, Z., Brock, L., Nieva, P. M., Vijayan M., "," SPIE Photonics West: OPTO, vol. 8269, San Francisco, January 2012

  • Hassanpour P.A., Nieva P.M., and Khajepour A., "," Accepted for publication in the Proceedings of the ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, Denver, CO, USA, November 11-17, 2011.

  • Asiaei S., Nieva P.M., "Self-assembled monolayers' fast kinetics of adsorption on gold, modeling and experiment in a heterogeneous immunoassay," Accepted to IEEE Sensors 2011, Limerick, Ireland, October 28-31, 2011.

  • Hassanpour P.A., Nieva P.M., and Khajepour A., "," Accepted for publication in the Proceedings of the International Conference on Applied Mathematics, Modeling and Computational Science - AMMCS-2011, 蓝莓视频, ON, Canada, July 25 - 29, 2011.

  • Godin J.R., Won S.P., Nieva P.M., Phong L.N., and Pope T., " Boston: TechConnect World, June 2011.

  • Norris R., Hamel J., and Nieva P.M., " Proceedings of the 24 IEEE International Conference on Micro-Electro-Mechanical-Systems, Cancun, Mexico, January 2011.

  • Denomme R., Iyer K., Kreder M., Smith B., and Nieva P.M., SPIE Photonics West MOEMS-MEMS, San Francisco, vol. 7927, January 2011.

  • Sohi A., Shavezipur M., Nieva P., and Khajepour A., ," Proc. 2nd. Microsyst. & Nanoelect. Research Conf. (MNRC 2009), Ottawa, ON, Canada, Oct. 13-14, 2009.

  • Effa D., Nieva P.M., Zwart A., Lancaster-Larocque S., 鈥鈥 Proc. IEEE, Advances in Systems and Sensors: Sensors and Applications, 42:10, pp. 597-602.

  • Bassiachvili E., Nieva P.M. and Khajepour A., 鈥On-chip Young's modulus characterization of heavily doped thin film Poly-Si at different temperature conditions,鈥 Proc. IMECE 2009, FL, USA, IMECE 2009-13083, Nov. 13-19, 2009.

  • Sohi A., Shavezipur M., Nieva P.M., and Khajepour A., 鈥鈥 Proc. IMECE 2009, FL, USA, IMECE 2009-12930, Nov. 13-19, 2009.

  • Shavezipur M., Wong C., Nieva P.M., and Khajepour A., 鈥Design and modeling of a MEMS capacitive temperature sensor with linear capacitance-temperature response,鈥 Proc. IMECE 2009, FL, USA, IMECE 2009-12790, Nov. 13-19, 2009.

  • Hassanpour P., Nieva P.M., and Khajepour A., 鈥鈥 Proc. IMECE 2009, FL, USA, IMECE 2009-12673, Nov. 13-19, 2009.

  • Hassanpour P., Wong C., Nieva P.M., and Khajepour A., 鈥鈥 Proc. IMECE 2009, FL, USA, IMECE 2009-12676, Nov. 13-19, 2009.

  • Zwart A., Effa D., Nieva P.M., and Lancaster-Larocque S., 鈥鈥 Nanotech Conference and Expo, Houston, TX, May 3-7, 2009, pp. 492-498.

  • Shavezipur M., Nieva P.M., Khajepour A., and Hashemi S., 鈥鈥, Nanotech Conference and Expo, Houston, TX, May 3-7, 2009, pp. 1-4.

  • Shavezipur M., Nieva, P.M., Khajepour A., and Hashemi S.M., 鈥鈥, Nanotech Conference and Expo, Houston, TX, May 3-7, 2009, pp. 1-4.

  • Shavezipur M., Hashemi S., Khajepour A., and Nieva P.M., 鈥鈥 Proc. IMECE 2008, ASME, Boston, MA, USA, IMECE 2008-68081, Oct. 31-Nov. 6.

  • Shavezipur M., Hashemi S., Khajepour A., and Nieva P.M., 鈥鈥 Proc. IMECE 2008, ASME, Boston, MA, USA, IMECE 2008-68090, Oct. 31-Nov. 6.

  • Norris R., Hamel J., and Nieva P.M., 鈥鈥 Proc. 7th IEEE Conf. Sensors, Lecce, Italy, Oct. 26-29, pp. 502-505.

  • Norris R., Nieva P.M., and Hamel J., 鈥鈥 Proc. 7th IEEE Conference on Sensors, Lecce, Italy, Oct. 26-29 2008, pp. 506-509.

  • Bassiachvili E., Stewart R., Shavezipur M., and Nieva P.M., 鈥鈥 Proc. 1st Microsyst. & Nanoelect. Research Conf. (MNRC 2008), Ottawa, ON, Canada, Oct. 15, pp 81-84.

  • Syed A., Mu L., Shavezipur M., and Nieva P.M., 鈥鈥 Proc. 1st Microsyst. & Nanoelect. Research Conf. (MNRC 2008), Ottawa, ON, Canada, Oct. 15, pp. 197-200.

  • Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J., 鈥鈥 Proc. 1st Microsyst. & Nanoelect. Research Conf. (MNRC 2008), Ottawa, ON, Canada, Oct. 15, pp. 201-204.

  • Topaloglu N., Elbuken C., Nieva P.M., Yavuz M., and Huissoon J., 鈥鈥 Proc. SPIE, Smart Struct. & Mat. 2008, San Diego, CA, USA, Vol. 6926, 692605.

  • Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J., 鈥鈥 Proc. SPIE Smart Struct. & Mat. 2008, San Diego, CA, USA, Vol. 6926.

  • Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J., 鈥Thermal Conductance Estimation for Uncooled Microbolometer Pixels,鈥 Proc. Can. Cong. Appl. Mech., Toronto, pp. 740-741.

  • Topaloglu N., Nieva P.M., Yavuz M., and Huissoon J., 鈥鈥 Proc. ISIE 2007 - IEEE Int. Symp. Ind. Elect., Vigo, Spain, June 2007.

  • Haghighat S., Nieva P.M., and Khajepour A., 鈥Analytical study of squeeze film damping in micro cantilever beams,鈥 Proc. Can. Cong. Appl. Mech., Toronto, pp. 452-453.

  • Nieva P.M., Adams G., McGruer N., 鈥鈥 Proc. SPIE, Smart Struct. & Mat. 2007, San Diego CA, USA, 6529, p. 77.

  • Nieva P.M., McGruer N. and Adams G., 鈥鈥 Tech. Proc. 2006 NSTI Nanotech. Conf., Boston, MA, 3, pp.419-422.

  • Nieva P.M, McGruer N., and Adams G., 鈥鈥 Proc. SPIE, Smart Struct. & Mat. 2006, San Diego, CA, USA, 6169, p. 23.

  • Nieva P.M., McGruer N., and Adams G., 鈥MEMS-based fabry-perot vibration sensor for harsh environments鈥, Proc. SPIE, Smart Struct. & Mat. 2006, San Diego, CA, USA, 6174, p. 75.

  • Bargmann M., Kumpel A., Tada H., Nieva P.M., Zavracky P., Miaoulis I., and Wong P., "" Mat. Res. Soc. Symp. Proc. Vol. 605, pp. 235-240, 2000.

  • Nieva P.M., Zavracky P., Adams G., Tada H., Abramson A., Miaoulis I., Wong P., "Temperature measurement during rapid thermal annealing using MEMS," Proc. 5th ASME/JSME Joint Thermal Eng. Conf., San Diego, CA, March 15-19, 1999.

  • Tada H., Nieva P.M., Zavracky P., Miaoulis I., and Wong P., "" Mat. Res. Soc. Proc. Vol. 546, pp. 39-44, 1999.

  • Nieva P.M., Tada H., Zavracky P., Adams G., Miaoulis I., and Wong P., "," Mat. Res. Soc. Proc. Vol. 546, pp. 97-102, 1999.

  • Tada H., Abramson A., Nieva P.M., Zavracky P., Miaoulis I., and Wong P., "," Proc. ASME IMECE 98, HTD-Vol.361-2, pp. 93-98, 1998.

  • Tada H., Abramson A., Nieva P.M., Zavracky P., Miaoulis I., and Wong P., "" Mat. Res. Soc. Symp. Proc. Vol. 518, pp. 161-166, 1998.

  • Nieva P.M., "Prices and costs of electricity in peru: typical cases" Symp. Electrical Energy, Peru 1996.

Keynote speeches

  • Nieva P.M., "MEMS sensors for harsh environments," Keynote speech at the 2007 Nano Science and Technology Institute (NSTI) Nanotechnology Conf. and Trade Show, Santa Clara, CA, USA, May 2007.

Invited talks

  • Nieva P.M., "Laser interferometry for harsh environment MEMS," 2008 March Meeting of the American Physical Society, March 13, 2008, New Orleans, USA

  • Nieva P.M., "MEMS sensors for harsh environment applications," Int. Elect. Pack. Symp., National Trends in Small Scale Syst.& Microelect. Packaging, July 31, 2007, NY, USA

  • Nieva P.M., "A novel MOEMS pressure sensor: modeling and experimental evaluation," 10th Int. Conf. Adv. Mat., IUMRS-International Conference on advanced Materials (ICAM) 2007, October 8-13, 2007, Bangalore, India.

Poster presentations (abstract refereed), application notes and others

  • Godin J.R., Won S.P., Nieva P.M., Phong L.N., and Pope T., "Residual stress dependency on wafer location of thin film Plasma-enhanced chemical vapor deposition聙聥 (PECVD) silicon nitride," Boston: TechConnect World, June 2011.

  • Iyer K., Denomme R., and Nieva P., "Using nanosphere lithography to fabricate nanoparticle arrays for plasmonic applications," CMC Microsystems Application Note, Online, March 2011, CMC-00200-01522

  • Dyck N., Denomme R., and Nieva P.M., "Flow injection analysis system for use in spectroscopic characterization of photonic devices in a microfluidic environment," CMC Microsystems Application Note, Online, September 2010, CMC-00200-01363

  • Denomme R., Asiaei S., Hassanpour P.A., Nieva P.M., Vijayan M., "Portable protein biosensor based on localized surface plasmon resonance聙聥 (LSPR) of metallic nanoparticles and interference spectroscopy," Lab-on-a-chip (LOAC) World Congress, 6-7 August 2009, San Francisco, CA, USA, 1008-LOAC.

  • Mu M., Syed A., Nieva P.M., "Using bent-bridges to eliminate the galvanic effect in the manufacture of MEMS devices fabricated in the MEMSCAP PolyMUMPs process,"; CMC Microsystems Application Note, MS-31-03.11.09-A, March 11, 2009.

  • Bassiachvili E., Nieva P.M., Khajepour A., "On-chip young's modulus characterization of the effect of heavy phosphorus doping on polysilicon thin films", International Mechanical Engineering Conference and Exposition, 13-19 November 2009, FL, USA, IMECE 2009-13083.

  • Nieva P.M., Bassiachvili E., Hassanpour P.A., Shavezipur M., Denomme R., Asiaei S., Norris R., Effa D., Hanitijo D.,"SimsLab at University of 蓝莓视频", International Mechanical Engineering Conference and Exposition (IMECE), 13-19 November 2009, FL, USA, IMECE 2009.

Patents

  • Nieva P.M., and Denomme R.C., "," US Patent Application No. 13/091,805, Filed on April 21, 2011. (Under Examination)