You
are
invited
by
the
IEEE
Electronics
Packaging
Society
(EPS)
student
chapter
at
the
University
of
ݮƵ
to
attend
the
following
seminar:
Title: Chiplet-Based Heterogeneous Integration
Location: The speaker will conduct the seminar remotely, but you have the option to join the seminar audience in-person in EIT 3142 - light refreshments will be served, or, you may and join the seminar online.
Abstract:
Chiplet-based integration is a paradigm shift that shapes the way we design our future systems. The concept is to move forward from large systems-on-chip that are limited by communication, thermal design power, and reticle size, toward a robust plug-and-play approach, where small, hardened IP heterogeneous off-the-shelf chiplets are seamlessly integrated on a single platform. In this talk, we will discuss the current state-of-the-art and challenges in chiplet integration, and specifically examine an ultra-large wafer-scale platform for applications, such as artificial intelligence acceleration, high-performance computing, and neuromorphic hardware.
Biography:
Boris Vaisband is an Assistant Professor at McGill University and a senior member of IEEE. His current research interests are in heterogeneous integration, neuromorphic circuits and systems, and formulation of design methodologies for heterogeneous systems, including power delivery, communication, thermal-aware design and floorplanning, and testing. Some applications of interest are ultra-large-scale artificial intelligence systems, high performance computing, hardware obfuscation, Internet of Things, and bio-compatible devices. In 2021, he received the Peter Silvester Faculty Research Award