��ݮ��Ƶ

Laser Machine Protolaser U3 (The Swiss Army Knife from LPKF)

ProtoLaser U3 is an ultra-fast and advanced PCB laser etching machine. The ProtoLaser U3 can etch circuits, drill holes, and depanel PCBs all in a single step. The ProtoLaser U3 provides a chemical-free process with no mechanical stress. A variety of materials, from flexible ones to silicon, can be etched and structured using the ProtoLaser U3.

• UV laser machine working at 355 nm.
• No mask, no mechanical stress, limited thermal stress and minimized debris. 
• Material diversity (PCBs, flexible materials, silicon, Alumina, etc.).
• Maximum material size: 9” x 12”. 
• Structuring, surface etching, depaneling, drilling, depth engraving, cutting, and skiving.
• Accuracy: 2µ. 
• Reputability: ±2 µm. 
• PCB structuring specs for I Oz copper thickness: minimum trace spacing= 20 µm,
  minimum trace width= 50µ.

Milling Machine Protomat S103 (LPKF)

The ProtoMat S103 provides precise, quick and simple in-house PCB prototyping, delivering PCBs in hours instead of days. Extensively equipped for multilayer, microwave and RF applications, the S103 is extremely fast and accurate, ensuring ultra-fine PCB prototyping. The system routes complex shapes and cut-outs, depanelizes populated PCBs, housing parts, or front panels, and processes substrates with delicate surfaces.

• Milling/drilling single & double-sided PCBs.
• Highest available speed: 100000 rpm.
• Resolution: 0.5 µm.
• Reputability: ±µm. 
• Pocketing mode. 
• Precision of front-to-back alignment: 20 µm.
• Max. material size: 9” x 12”. 
• No mechanical stress.
• Limited thermal stress.

Multilayer Press Multipress S (LPKF)

The LPKF MultiPress S is a bench-top multilayer press, ideal for creating multilayer circuit boards in a laboratory or prototyping environment. With a shorter pressing time of approximately ninety minutes, the system offers faster turnaround times than ever before.

• Maximum layout area: 8.2” x 11.2”.
• Maximum pressure: 286 N/cm².
• Maximum number of layers: 8.

Through-hole Plating Contac RS (LPKF)

The LPKF Contac RS and MiniContac RS are through-hole plating systems specially developed for the professional production of prototype and small batch production printed circuit boards, featuring Reverse Pulse Plating and unmatched ease-of-use. The systems are ideal for any rapid PCB prototyping situation, especially small runs and tight work locations.

• Reverse Pulse Plating (RPP) mode for high-quality plating.
• Maximum PCB size: 13” x 18”.
• Hole diameter: >200 µm. 
• Ideal for through-hole plating multilayer PCBs. 
• Number of through-plated holes: No limit.
• Maximum number of layers: 8. 
• Maximum contact resistance: 10 mΩ.
• Chemical thinning: Yes. 
• Activator: Carbon.

SMB Rapid Prototyping

• ProtoPrintS (LPKF): Manual fine-pitch stencil printer for accurately positioning and dispensing solder paste onto PCBs.
• LPKF ProtoFlow S: Reflow oven for lead-free soldering features a large material size and precisely controlled temperature profile.
• LPKF ProtoPlace S: Pick&Place system for accurately positioning SMT components on PCBs – from small chips to large QFPs.

Die-bonder Fine Placer Lambda (Finetech)

The flexible Fine placer Lambda is a sub-micron die-bonder for precision die-attaching and advanced chip packaging. It offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation are key.

• Placement accuracy: 0.5µm.
• Component size: Minimum 0.1 x 0.1 mm and Maximum 15 by 15 mm.
• Bonding force range: 0.1-400 N.
• Heating Temp. (Max.): 400^o ��.��
• Precise die bonding (face up), laser bar bonding, photo diode bonding, LED bonding, Micro optics assembly, MEMS packaging, Sensor packaging, Bump Bonding, 3D packaging, Chip on glass, chip on flex. 
• Unique optical resolution.
• Handles ultra-small components with special tooling. 
• Closed loop force control.
• Virtually unlimited range of advanced bonding technologies. 
• User independent die placement and process operation. 
• Provides high level of reproducibility and application flexibility.
• Synchronized control of all process related parameters: force, temperature, time, flow, power, process environment, light and vision. 
• Flip chip bonding (face down).

Programmable Wire Bonder HB16 (TPT)

The HB16 is a bench top size wire bonder, ideal for small-scale production lines. One bond head for bonding a Ball/Wedge or Wedge/Wedge bonding mode.

• Bonding method: Wedge-Wedge, Ball-Wedge, Ribbon-bonding, Bump bonding, Gold and aluminum wire.
• Wire diameter: 17 – 70 µm.
• Ribbon size: maximum 25×250 µm.
• Electronic ball size control.